JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. EIAJ EDA – Read more about eiaj, jeita and EIAJ ED ꞉ (EN) Enviado por Selvakpm Direitos autorais: © All Rights Reserved. Baixe no formato PDF ou leia online no Scribd.

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Thank you for your cooperation. Nobuyuki Kawayoshi Sharp Corp. Handling guidance for semiconductor devices.

Sharp-Reliability Test Standard for IC_图文_百度文库

Therefore, measuring by the sampling method was agreed during discussion. A bending stress may occur to a solder joint on the printed circuit when key on the keyboard is pressed. T is the temperature variation in the temperature cycle, V is the solder volume at the soldering joint, r is the radius of the bump, and? About the devices for evaluation and the test method There are two types of specimen that are used for the evaluation specified in the standard.

In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

3-3 Standards Related to Reliability Test |Sanken Electric

According to equations 12and 3acceleration factor AF of the two different conditions is given as follows: Standards 20 Functioning Temp. In the modified equation, the heat fatigue strain amplitude?


F 2times B ? Figure 1 shows an example of method 1. Mounting conditions, printed wiring boards, soldering materials, and so on affect significantly the kk Note 1. Non-destructive recognition procedures of defin Silicon Carbide Wafers Part 1: The life tests and the strength tests was subdivided according to the revision frequency. Test 2h 1h cycles: This standard is specified of a bend stress of solder joint on a printed circuit board as a part of standard of a reliability test method.

In addition, the drop test has mainly performed with the conditions from cellular phone makers and other mobile device makers. B T H B Temperature: It is intended by this to prediction the failure rate and the useful life of the parts and components to be incorporated into the final products systems under the conditions of actual use and thus to make sure of the targeted reliability and endurance of the final products.

It is well known that the life of soldering becomes about a half when in particular the packages of area pin type are mounted on the same area of both sides of the board. Environmental Conditions and Equipment Failure Mode: Isopropyl alcohol to Solvents Immersion Time: This test method considers the following situation in field use. The heating treatment, equivalent to the actual mounting by soldering, which the specimens are submitted to. Environmental and endurance test methods for semiconductor devices Life test II.

In er-4702 case of the sampling method, actual device is mainly measured. The solder grain size shall be meshes or less. However, it is used in the standard to simply and clearly describe the type of the package outline subject to the standard. The final revision planing was decided to above-mentioned 6 separate ed-44702. And, the application of this test method specified in the detail specifications.


Apply flux to the leads of the sample SMD.

The specimen shall be dropped with caught by a tool like arm. When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications. Table 2 Standard mount reliability test board layer configuration Types A, B, and C 1st layer 2nd layer 3rd layer 4th layer Signal path layer Plane layer or mesh layer Plane layer or mesh layer Signal path layer 1st layer 2nd layer 3rd layer 4th layer 5th layer 6th layer Type D Signal path layer Plane layer or mesh layer Plane layer or mesh layer Plane layer or mesh layer Plane layer or mesh layer Signal path layer Note: The ambient temperature when the specimen is stored in inoperative state.

Test temperature and time are 12 Thermal t1 to be ekaj stipulated by individual Shock specification. Classification 1 Test preparation Appendix 1: