IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
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Under-fill or staking material Note1: The user see 1.
Solder does nol touch package body or end seal. Once parts are mounted on printed boards, the unsoldered assembly shall  be handledtranspOJ1ed e. Solder shall [D1D2D3] be visible in the inspection hole if present. Insul ation shall not [DID2D3] have c uts, breaks, cracksor splits b. AFigure Terminal Mounting – Electrical 1. Static Extraction Methods should be performed in compliance with Test Method 2.
The end of the part is defined to include 00e1 coatingsolder sealsolder or weld beador any j-dtd extension. The user has the responsibility to determine the most current revision level of IPC and specify the specific application to their product. It j-stx the responsibi Ji ty of the manufacturer see 1. Not negate stress relief Celsius is used to express temperature.
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
Such mechanical securing should prevent movement between the parts of the connection during the solderi ng operatio n. Tools and equipment are to be c1 ean prior lO use and should be kept c1ean and free of dirtgreaseftuxoil and other foreign matter during use.
Plane Void Criteria Note 6 Note1: To provide for per sonnel safety, follow the applicable local and Federal OccupationalSafety and Health Regulations? AWG and smaller 2.
Minimize tirne to market? SoJder is wetted to the solder balls and! Pe rcentage 01 land area covered w ith wetted solder.
Protection may be provided through a contro lIed heating process 4. Criteria for switching to sample based inspection is defined.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
This c1 ause does nol app ly to sleeved glass bodied axial leaded components see lO. When another ftux is used see 3.
A wire that is wrapped more than and crosses over itselti. If j-dtd on ends, toe curl should not exceed two times lhe thickness of the lead 7. Apri l 7.
If any printed circuit assembly failsthe entire lot shall [D ] be evaluated and recleaned if necessary and a random sample of this lot and each lot c1 eaned since performing the last acceptable cIeanliness test shall  be tested The frequency of testing shall [N1P2D3] be a minimum of once each production shift unless the process control system data supports a change in frequency 8.
These soldcr connections are acceptable Wetting ca nnot always be judged by surface appearance. The items cleaned sha ll  be capablc of meeting the cleanliness requirement as specified herein see 8. For each intermediate bifurcated terminalthe wire passes through the s lot and is in contact with the base of the terminal or a previollsly installed Wlre c.
The use of “statistical process control” SPC is optional and should be based on factors 5uch as design stability, lot size. See Appendix A for guidelines on tool selec ti on and maintenance. The lead-to-body seal or weld shall not [DID2D3] be damaged by the deformation c. Wh en soldering these types of components voiding i n the thermal plane i s common Notc: T his requirement does oot apply to components that are designed such that a portion of the lead is intended to be removed after soldering e.
Rework is covered in After soldering operations have been perfonmedlhe assembly shall [D I] be sufficienlly cooled so the solder is solidified prior to further handling 4.
Equipment groundingprotection and temperature control testing should be per forrned when qua1i fying equipment for purchase andlor inspection of new or repaired equipmen t. If your company buys lPC standards and public. Solder may compl etel y fi ll the sl ot 5.
The external interconnect points e. J 2 Heat Shrinkable Soldering Devices Historically, electronic assembly solderi ng j-sgd contained a more comprehensive tutorial addressing principles and techniques.
The solder bath temperaturebased on the solder alloy in useshall [NID2D3] be set at a predetermined value with a tolerance of j: The attachments should be m ai ntained such that clearance between wires an d clearance between the wires and the terminal board or panel is a minimum consistent with the w?
The magnification power requirement shall O ID2D3 be based on the size of the device being inspected. T he wire shall oot [AIP] extend above the top of the terminal po st.